Laser Cleaning For Semiconductor Industry

As semiconductor technology continues to shrink, advanced integrated circuit devices have transformed from planar to three-dimensional structures. The integrated circuit manufacturing process is becoming more and more complex, often requiring hundreds or even thousands of process steps. For advanced semiconductor device manufacturing, after each process, there will be more or less particulate pollutants, metal residues or organic residues on the surface of the silicon wafer. The continuous shrinking of device feature sizes and the increasing complexity of three-dimensional device structures have made semiconductors Devices are increasingly sensitive to particle contamination, impurity concentration and quantity.

Higher requirements have been put forward for the cleaning technology of contaminated particles on the mask surface of silicon wafers. The key point is to overcome the huge adsorption force between the contaminated particles and the substrate. At present, many semiconductor manufacturers use acid cleaning methods. Washing and manual wiping are not only inefficient but also produce secondary pollution. So what kind of cleaning method is currently more suitable for cleaning semiconductor products? Laser cleaning is currently a more suitable method. When the laser scans over, all the dirt on the surface of the material will be removed, and the dirt in the gaps will be removed. It can be removed easily, will not scratch the material surface, and will not cause secondary pollution. It is a safe choice.

In addition, as the size of integrated circuit devices continues to shrink, material loss and surface roughness during the cleaning process have become issues that must be paid attention to. Removing particles without material loss and pattern damage is the most basic requirement. Laser cleaning technology has unique Contact, no thermal effect, no surface damage to the object to be cleaned, and no secondary pollution, which are incomparable advantages of traditional cleaning methods. It is the best cleaning method to solve the pollution of semiconductor devices.